Hardware & IoT

International Symposium on Microelectronics and Packaging (ISMP cor)

The 24th International Symposium on Microelectronics Packaging (ISMP 2026) is a conference focused on microelectronics packaging. It is organized by the Korean Microelectronics Packaging Society and includes plenary, keynote, and invited speakers. The event is intended for professionals and researchers in the microelectronics packaging field.

7 weeks until it opens.

The essentials

Event details

Dates
3 November 2026 to 6 November 2026
Organiser
KMEPS
Industry
Hardware & IoT

On stage

Speakers

  • Terry KangMember of Technical Staff, OpenAI Inc., USA
  • Ji Yong ParkVice President, SK hynix Inc., Korea
  • Bill EnCorporate Vice President, AMD (Advanced Micro Devices, Inc.), USA
  • KyungRok ParkCorp. Vice President, Amkor Technology Korea, Inc., Korea
  • Zsolt TokeiFellow, IMEC (Interuniversity Microelectronics Centre), Belgium
  • Won Kyoung ChoiVice President, Samsung Electronics Co., Ltd., Korea
  • Nandish MehtaSenior Research Scientist, NVIDIA Corporation, USA
  • Chris ScanlanSenior Vice President, BESI (BE Semiconductor Industries NV), Switzerland

Logistics

Where to stay

Places to stay near the venue.

  • EZSTAY Nampo Hotel

    240 m from the venue

    30-13 광복로67번길, 부산광역시, 48949

  • Hotel Foxy

    350 m from the venue

  • Elysee Hotel

    360 m from the venue

  • Aria Hotel

    370 m from the venue

  • 호텔 아벤트리 부산

    370 m from the venue

    6 광복로39번길

  • So Yu Hotel

    410 m from the venue

  • Boutique Hotel YTT

    410 m from the venue

  • Sam won jung

    420 m from the venue

Stay on it

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