Hardware & IoT
IC & Sensor Packaging Expo Japan - Osaka
This exhibition focuses on IC final manufacturing and IC and sensor packaging technology. It gathers advanced equipment, materials, and services for the industry.
The essentials
Event details
- Dates
- 12 May 2027 to 14 May 2027
- Location
- Intex Osaka, Osaka, Japan
- Organiser
- RX Japan
- Industry
- Hardware & IoT
Agenda themes
Topics covered
- electronic design
- R&D
- manufacturing
- semiconductor
- packaging
- pcb
- smt
- Asia
- exhibition
- Japan
Logistics
Where to stay
Places to stay near the venue.
カンデオホテルズ大阪ザ・タワー
1-1-27 Dojimahama, Osaka-shi Kita-ku , Osaka, 530-0004
相鉄フレッサイン
The Rise Osaka Kitashinchi
WELCOME INN YODOYABASHI
御宿 野乃 大阪淀屋橋
19
三交イン
HOTEL KEIHAN
ホテルユニゾ
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Work out who to meet here
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