Manufacturing
Adhesion & Bonding Expo - Osaka
Adhesion & Bonding Expo is an industrial adhesion expo. It presents joining equipment and bonding technologies, including adhesive agents, welding, and dissimilar material joining. This B-to-B trade show is for professionals in industries such as automotive, electronics, and construction.
The essentials
Event details
- Dates
- 12 May 2027 to 14 May 2027
- Location
- Intex Osaka, Osaka, Japan
- Organiser
- RX Japan
- Industry
- Manufacturing
Who attends
The audience
Attendees can explore a wide variety of adhesive agent, test out industrial equipment, and learn from industry experts throughout the technical conference sessions.
As described by the organiser
Agenda themes
Topics covered
- joining equipment
- dissimilar material joining technologies
- materials
- films
- plastics
- ceramics
- metals
- laser technologies
- electronic displays/display technologies
- recycling technologies
- heat technologies
- exhibition
Logistics
Where to stay
Places to stay near the venue.
カンデオホテルズ大阪ザ・タワー
1-1-27 Dojimahama, Osaka-shi Kita-ku , Osaka, 530-0004
相鉄フレッサイン
The Rise Osaka Kitashinchi
WELCOME INN YODOYABASHI
御宿 野乃 大阪淀屋橋
19
三交イン
HOTEL KEIHAN
ホテルユニゾ
Stay on it
Get the next edition
When Adhesion & Bonding Expo - Osaka announces its next edition, or these dates change, we read it from the organiser's own site. One email when that happens, nothing else.
Plan this event
Work out who to meet here
Luminik sources the attendee picture for an event like Adhesion & Bonding Expo - Osaka, enriches it against your ICP, and sequences it ahead of the date. Capture at the event writes to Salesforce or HubSpot the same day, and attribution ties the pipeline back to the spend.
Spot something wrong on this page? Report a correction and we will fix it.
Is this your event? Verify it with your work email: one click in your inbox proves it is yours, we approve, and the badge goes up, usually within a day. Prefer the form?