Hardware & IoTMar 1-4, 2027, Phoenix, United States

Device Packaging Conference 2027

Call for speakers, 6 weeks left

The Device Packaging Conference is a flagship annual event for leaders and innovators in microelectronics, advanced packaging, and system integration. It offers opportunities for collaboration, knowledge exchange, and advancement across the microelectronics packaging ecosystem.

About this speaking opportunity

Device Packaging Conference 2027 is a hardware & iot conference in Phoenix, United States, running Mar 1-4, 2027. Submissions close Oct 9, 2026.

Full event details, including the agenda and who else is on the floor, are on the Device Packaging Conference 2027 event page.

Topics this event covers

PackagingAging

Want the stage?

Submit your talk on the conference's own call-for-speakers page. Deadlines move, so confirm before you write.

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